The European Commission has announced a public consultation on the so-called “Transparency Directive” (89/105/EEC), which is designed to facilitate the free movement of medicines in the European Union. The directive has not been amended since it was adopted in 1989; it is unlikely that this tradition will be upheld. Of particular interest to medtech OEMs: [...]
This was my first SNUG (Synopsys User Group) meeting as media. In the past, media was not allowed in so it was a ground breaking event. Media was still barred from some of the sessions but hey, its a start. The most blog worthy announcement on day 1 was that Synopsys signed a deal with Amazon to bring the cloud to mainstream EDA!Silicon IP Verification IP Software IP News Industry Articles HOME SEARCH IP IP BASED SOC NEWS DESIGN ARTICLES BLOGS New IP-SOC 2011 SITE FEATURES MY D R D R PRODUCTS Login Register D R SoC News Alert RSS Submit Material Your Ad Here , Buy Now Industry Expert Blogs Wide I O Memory and 3D ICs A New Dimension for Mobile Devices Industry Insights Blog Richard Goering Cadence Mar . 29, 2011 There's a lot of excitement about 3D ICs with through-silicon vias TSVs and one reason is that stacked die can provide very fast memory access . That's why wide I O is emerging as a significant new direction for 3D ICs and why the March 28 Cadence announcement of the first wide I O memory controller IP may help spur the coming era of 3D . integration Wide I O memory is a new DRAM technology and an emerging